The Harvey Rosten Award For Excellence commemorates Harvey's achievements in the field of thermal analysis of electronics equipment, and the thermal modeling of electronics parts and packages. Its aims are to encourage innovation and excellence in these fields. The Award is presented annually, and is in the form of a plaque and a $1000 cash prize.
To be eligible, the work has to be:
Favorable consideration will be given to work that demonstrates:
The author(s) of the winning paper is(are) notified by the Selection Committee.
The presentation is made to the author. In case of co-authored papers, the presentation would normally be made to the leading author. This year’s Award will be presented at the IEEE SEMI-THERM Symposium. For more information on the SEMI-THERM Symposium visit the SEMI-THERM home page.
The Harvey Rosten award for Excellence is supported by Simcenter Simulation and Test Solutions, Siemens Digital Industries Software in Harvey’s honor.
Eligible works are scored out of 10 against each of the five following dimensions:
Context : Work in thermal analysis, thermal modeling or thermal testing of electronic components, parts and systems, including insight into the physical processes affecting thermal behavior and experiments aimed specifically at validating and calibrating numerical models
Pragmatic : The work takes a pragmatic approach that demonstrates clear application to practical electronics design
Innovation : Work is innovative in embodying an understanding in thermal analysis, thermal modeling, thermal design or test equipment
Broad Applicability : Work will benefit to the broad electronics thermal community,with the potential for the results to become accessible within a foreseeable time frame
Accessibility : Work is documented using correct English grammar, is easily readable, well structured and reasoned
Dr. Clemens Lasance, Principal Scientist, Philips Research, Retired
Dr. Robin Bornoff, Siemens Digital Industries Software, (Chairperson)
Dr. John Parry, Siemens Digital Industries Software
Dr. Cathy Biber, Thermal Systems Engineer, Intel Corporation
Dr. Jim Wilson, Engineering Fellow, Raytheon
If you would also like to send a copy of the paper, please contact:
Dr. John Parry
c/o Mentor Graphics
81 Bridge Road
Hampton Court
Surrey KT8 9HH
United Kingdom
Phone: +44 (0)208 487 3108
E-mail: john_parry@mentor.com
2021
Sujay Singh, Joe Proulx, Andras Vass-Varnai
Measuring the RthJC of Power Semiconductor Components Using Short Pulses
27th THERMINIC Workshop, Berlin, Germany, September 2021
2020
Sajad Alimohammadi, Tim Persoons
A Novel Linear Air Amplifier Technology to Replace Rotary Fans in Data Center Server Rack Cooling
26th THERMINIC Workshop, Berlin, Germany, September 2020
2019
Baver Ozceylan, Boudewijn R. Haverkort, Maurits de Graaf, Marco E. T. Gerards
A Generic Processor Temperature Estimation Method 25th THERMINIC Workshop, Lecco, Italy, September 2019.
2018
James W. VanGilder, Christopher M. Healey, Michael Condor, Wei Tian, Quentin Menusier
A Compact Cooling-System Model for Transient Data Center Simulations 34th SEMI-THERM Conference, San Jose, March 2018.
2017
János Hegedüs, Gusztáv Hantos, András Poppe
Lifetime isoflux control of LED based light sources
23rd THERMINIIC Workshop, Amsterdam , NL, September 2017.
2016
Robin Bornoff, John Wilson, and John Parry
Subtractive Design: A Novel Approach to Heatsink Improvement
32nd SEMI-THERM Symposium, San Jose, CA USA, March 2016
2015
Lorenzo Codecasa, Vincenzo d’Alessandro, Alessandro Magnani, and Niccolò Rinaldi
Structure Preserving Approach to Parametric Dynamic Compact Thermal Models of Nonlinear Heat Conduction
31st THERMINIC Workshop, Paris, France, October 2015
2014
Cameron Nelson, Jesse Galloway, and Phillip Fosnot
Extracting TIM Properties With Localized Transient Pulses
30th SEMI-THERM Conference at San Jose, CA in March 2014
2013
Wendy Luiten
Solder joint Lifetime of Rapid Cycled LED Components
19th THERMINIC Conference at Berlin Germany, in September 2013
2012
András Poppe
A Step Forward in Multi-domain Modeling of Power LEDs
28th SEMI-THERM Symposium at San Jose, CA, in March 2012
2011
Alfonso Ortega, K.S.Harinadh Potluri, and Bryan Hassel
An Investigation of Multi-Layer Mini-Channel Heat Sinks with Channel Geometric Scale Variation Suggested by Constructal Scaling Principles
27th SEMI-THERM Symposium at San Jose, CA, in March 2011
2010
Dirk Schweitzer
The Junction-To-Case Thermal Resistance: A Boundary Condition Dependent Thermal Metric
26th SEMI-THERM Symposium at San Jose, CA, in March 2010
2009
Suresh V. Garimella and Tannaz Harirchian
Boiling Heat Transfer and Flow Regimes in Microchannels – a Comprehensive Understanding
15th THERMINIC Workshop at Leuven, Belgium, in October 2009
2008
R. J. Linderman, T. Brunschwiler, U. Kloter, H. Toy, B. Michel
Hierarchical Nested Surface Channels for Reduced Particle Stacking and Low-Resistance Thermal Interfaces
23rd SEMI-THERM Symposium at San Jose, CA, in March 2007
2007
Raghav Mahalingam and Ari Glezer
For their pioneering work in synthetic jets (microjets) for electronics cooling applications over a number of years, described in a number of conference papers, journal papers and magazine articles.
Dan S. Kercher, Jeong-Bong Lee, Oliver Brand, Mark G. Allen, and Ari Glezer
Microjet Cooling Devices for Thermal Management of Electronics
IEEE Transactions on Components And Packaging Technologies, Vol. 26, No. 2, June 2003, pp. 359 – 366
Raghav Mahalingam, Nicolas Rumigny, and Ari Glezer
Thermal Management Using Synthetic Jet Ejectors
IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 3, Sept. 2004, pp. 439 – 444
Raghav Mahalingam
Modeling of Synthetic Jet Ejectors for Electronics Cooling
Proceedings of 23rd IEEE SEMI-THERM Symposium, 18-22 March 2007, pp. 196 – 199
Raghav Mahalingam, Sam Heffington, Lee Jones and Randy Williams
Synthetic Jets For Forced Air Cooling Of Electronics
ElectronicsCooling, Vol. 13, No. 2, May 2007, pp. 12-18
2006
Peter E. Raad, Pavel L. Komarov, and Mihai G. Burzo
A Coupled Thermoreflectance Thermography Experimental System And Ultra-Fast Adaptive
Computational Engine For The Complete Thermal Characterization Of Three-Dimensional Electronic Devices: Validation
THERMINIC Workshop at Nice, Côte d’Azur, France in September 2006
2005
Clemens Lasance
Exceptional Award, made in recognition of his pioneering contributions over two decades to understanding and predicting the thermal behaviour of electronics equipment. 2004
2004
Bruce Guenin
For his many published contributions in the field of electronics thermal management, including championing thermal standards through the JEDEC JC15.1 Committee, of which he is Chairman. Notably, these include the “JEDEC Two-Resistor Compact Model Standard” and the “JEDEC DELPHI Compact Model Guideline”, both of which were being balloted by the Committee at the time of the Award.
2003
Heinz Pape, Dirk Schweitzer, John H.J. Janssen, Arianna Morelli and Claudio M. Villa
Thermal Transient Modeling and Experimental Validation In the European Project PROFIT SEMI-THERM Symposium at San Jose, CA, in March 2003
2002
Eric Bosch & Mohamed-Nabil Sabry
Thermal compact models for electronic systems
SEMI-THERM Symposium at San Jose, CA, in March 2002
2001
John Guarino & Vincent Manno
Characterization of Laminar Jet Impingement Cooling in Portable Computer Applications SEMI-THERM Symposium at San Jose, CA, in March 2001
2000
Marta Rencz & Vladimir Székely
Dynamic thermal multiport modeling of IC packages
THERMINIC Workshop at Budapast, Hungary, in September 2000
1999
Validation and Application of Different Experimental Techniques to Measure Electronic Component Operating Junction Temperature
John Lohan, Peter Rodgers, Carl-Magnus Fager, Reijo Lehiniemi, Valérie Eveloy, Pekka Tiilikka, and Jukka Rantala
Transactions of IEEE CPMT, Vol. 22, No. 2, June 1999, pp.252-258
Effect of PCB Thermal Conductivity on the Operating Temperature of an SO-8 Package in a Natural
Convection Environment: Experimental Measurement versus Numerical Prediction
John Lohan, Pekka Tiilikka, Peter Rodgers, Carl-Magnus Fager, Jukka Rantala
Proceedings of 5th THERMINIC Workshop, Rome Italy, October 3-6, 1999, pp.207-213
Validating Numerical Predictions of Component Thermal Interaction on Electronic Printed Circuit
Boards in Forced Convection Airflows by Experimental Analysis
Peter Rodgers, John Lohan, Valérie Eveloy, Carl-Magnus Fager, and Jukka Rantala
Proceedings of InterPACK Conference, Maui, USA, June 13-17, 1999, Vol. 1, pp.999-1009
Impact of Convective Environment on the Distribution of Heat Transfer from Three Electronic
Component Package Types – Operating on Single- and Multi-Component Printed Circuit Boards
Peter Rodgers, John Lohan, Valérie Eveloy, and Carl-Magnus Fager
Proceedings of 5th THERMINIC Workshop, Rome Italy, October 3-6, 1999, pp.214-220
Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component
Printed Circuit Boards in Natural Convection Environments
Peter Rodgers, Valérie Eveloy, John Lohan, Carl-Magnus Fager, Pekka Tiilikka, and Jukka Rantala
Proceeding of SEMI-THERM XV, San Diego, CA, USA, March 9-11 1999, pp.54-64
Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component
Printed Circuit Boards in a Forced Convection Environment: Part 1 – Experimental and Numerical Modelling
Peter Rodgers, Valérie Eveloy, John Lohan, Carl-Magnus Fager, and Jukka Rantala
Proceedings of ASME 33rd NTHC, Albuquerque, NM, USA, August 15-17, 1999
Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component
Printed Circuit Boards in a Forced Convection Environment: Part 1 – Experimental and Numerical Modelling
Peter Rodgers, Valérie Eveloy, John Lohan, Carl-Magnus Fager, and Jukka Rantala
Proceedings of ASME 33rd NTHC, Albuquerque, NM, USA, August 15-17, 1999
Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component
Printed Circuit Boards in a Forced Convection Environment: Part 1 – Experimental and Numerical Modelling
Peter Rodgers, Valérie Eveloy, John Lohan, Carl-Magnus Fager, and Jukka Rantala
Proceedings of ASME 33rd NTHC, Albuquerque, NM, USA, August 15-17, 1999
Eric Eggink
Thermal Management in Industrial Product Development
EUROTHERM seminar atNantes, France, in September 1997
The Harvey Rosten award for Excellence is supported by Mentor Graphics’ Mechanical Analysis Division.
The award is planned to be announced at the next SEMI-THERM Symposium in March 2023 (www.semi-therm.org)
Measuring the RthJC of Power Semiconductor Components Using Short Pulses
27th THERMINIC Workshop, Berlin, Germany, September 2021
A Novel Linear Air Amplifier Technology to Replace Rotary Fans in Data Center Server Rack Cooling
26th THERMINIC Workshop, Berlin, Germany, September 2020
A Generic Processor Temperature Estimation Method
25th THERMINIC Workshop, Lecco, Italy, September 2019.
A Compact Cooling-System Model for Transient Data Center Simulations
34th SEMI-THERM Conference, San Jose, March 2018.
Lifetime isoflux control of LED based light sources
23rd THERMINIIC Workshop, Amsterdam , NL, September 2017.
Subtractive Design: A Novel Approach to Heatsink Improvement
32nd SEMI-THERM Symposium, San Jose, CA USA, March 2016
Structure Preserving Approach to Parametric Dynamic Compact Thermal Models of Nonlinear Heat Conduction
31st THERMINIC Workshop, Paris, France, October 2015
Extracting TIM Properties With Localized Transient Pulses
30th SEMI-THERM Conference at San Jose, CA in March 2014
Solder joint Lifetime of Rapid Cycled LED Components
19th THERMINIC Conference at Berlin Germany, in September 2013
A Step Forward in Multi-domain Modeling of Power LEDs
28th SEMI-THERM Symposium at San Jose, CA, in March 2012
An Investigation of Multi-Layer Mini-Channel Heat Sinks with Channel Geometric Scale Variation Suggested by Constructal Scaling Principles
27th SEMI-THERM Symposium at San Jose, CA, in March 2011
The Junction-To-Case Thermal Resistance: A Boundary Condition Dependent Thermal Metric
26th SEMI-THERM Symposium at San Jose, CA, in March 2010
Boiling Heat Transfer and Flow Regimes in Microchannels - a Comprehensive Understanding
15th THERMINIC Workshop at Leuven, Belgium, in October 2009
Hierarchical Nested Surface Channels for Reduced Particle Stacking and Low-Resistance Thermal Interfaces
23rd SEMI-THERM Symposium at San Jose, CA, in March 2007
For their pioneering work in synthetic jets (microjets) for electronics cooling applications over a number of years, described in a number of conference papers, journal papers and magazine articles.
Microjet Cooling Devices for Thermal Management of Electronics
IEEE Transactions on Components And Packaging Technologies, Vol. 26, No. 2, June 2003, pp. 359 - 366
Thermal Management Using Synthetic Jet Ejectors
IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 3, Sept. 2004, pp. 439 - 444
Modeling of Synthetic Jet Ejectors for Electronics Cooling
Proceedings of 23rd IEEE SEMI-THERM Symposium, 18-22 March 2007, pp. 196 - 199
Synthetic Jets For Forced Air Cooling Of Electronics
ElectronicsCooling, Vol. 13, No. 2, May 2007, pp. 12-18
A Coupled Thermoreflectance Thermography Experimental System And Ultra-Fast Adaptive Computational Engine For The Complete Thermal Characterization Of Three-Dimensional Electronic Devices: Validation
THERMINIC Workshop at Nice, Côte d'Azur, France in September 2006
Exceptional Award, made in recognition of his pioneering contributions over two decades to understanding and predicting the thermal behaviour of electronics equipment.
For his many published contributions in the field of electronics thermal management, including championing thermal standards through the JEDEC JC15.1 Committee, of which he is Chairman. Notably, these include the “JEDEC Two-Resistor Compact Model Standard” and the “JEDEC DELPHI Compact Model Guideline”, both of which were being balloted by the Committee at the time of the Award.
Thermal Transient Modeling and Experimental Validation In the European Project PROFIT
SEMI-THERM Symposium at San Jose, CA, in March 2003
Thermal compact models for electronic systems
SEMI-THERM Symposium at San Jose, CA, in March 2002
Characterization of Laminar Jet Impingement Cooling in Portable Computer Applications
SEMI-THERM Symposium at San Jose, CA, in March 2001
Dynamic thermal multiport modeling of IC packages
THERMINIC Workshop at Budapast, Hungary, in September 2000
Validation and Application of Different Experimental Techniques to Measure Electronic Component Operating Junction Temperature
John Lohan, Peter Rodgers, Carl-Magnus Fager, Reijo Lehiniemi, Valérie Eveloy, Pekka Tiilikka, and Jukka Rantala
Transactions of IEEE CPMT, Vol. 22, No. 2, June 1999, pp.252-258
Effect of PCB Thermal Conductivity on the Operating Temperature of an SO-8 Package in a Natural Convection Environment: Experimental Measurement versus Numerical Prediction
John Lohan, Pekka Tiilikka, Peter Rodgers, Carl-Magnus Fager, Jukka Rantala
Proceedings of 5th THERMINIC Workshop, Rome Italy, October 3-6, 1999, pp.207-213
Validating Numerical Predictions of Component Thermal Interaction on Electronic Printed Circuit Boards in Forced Convection Airflows by Experimental Analysis
Peter Rodgers, John Lohan, Valérie Eveloy, Carl-Magnus Fager, and Jukka Rantala
Proceedings of InterPACK Conference, Maui, USA, June 13-17, 1999, Vol. 1, pp.999-1009
Impact of Convective Environment on the Distribution of Heat Transfer from Three Electronic Component Package Types - Operating on Single- and Multi-Component Printed Circuit Boards
Peter Rodgers, John Lohan, Valérie Eveloy, and Carl-Magnus Fager
Proceedings of 5th THERMINIC Workshop, Rome Italy, October 3-6, 1999, pp.214-220
Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in Natural Convection Environments
Peter Rodgers, Valérie Eveloy, John Lohan, Carl-Magnus Fager, Pekka Tiilikka, and Jukka Rantala
Proceeding of SEMI-THERM XV, San Diego, CA, USA, March 9-11 1999, pp.54-64
Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in a Forced Convection Environment: Part 1 - Experimental and Numerical Modelling
Peter Rodgers, Valérie Eveloy, John Lohan, Carl-Magnus Fager, and Jukka Rantala
Proceedings of ASME 33rd NTHC, Albuquerque, NM, USA, August 15-17, 1999
Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in a Forced Convection Environment: Part 2 - Results and Discussion
Peter Rodgers, Valérie Eveloy, John Lohan, Carl-Magnus Fager, and Jukka Rantala
Proceedings of ASME 33rd NTHC, Albuquerque, NM, USA, August 15-17, 1999
Thermal Management in Industrial Product Development
EUROTHERM seminar atNantes, France, in September 1997