The Harvey Rosten Award For Excellence commemorates Harvey's achievements in the field of thermal analysis of electronics equipment, and the thermal modeling of electronics parts and packages. Its aims are to encourage innovation and excellence in these fields. The Award is presented annually, and is in the form of a plaque and a $1000 cash prize.
If you would also like to send a copy of the paper, please contact:
Dr. John Parry
c/o Mentor Graphics
81 Bridge Road
Hampton Court
Surrey KT8 9HH
United Kingdom
Phone: +44 (0)208 487 3108
E-mail: john_parry@mentor.com
The award is planned to be announced at the next SEMI-THERM Symposium in March 2021 (www.semi-therm.org)
A Generic Processor Temperature Estimation Method
25th THERMINIC Workshop, Lecco, Italy, September 2019.
A Compact Cooling-System Model for Transient Data Center Simulations
34th SEMI-THERM Conference, San Jose, March 2018.
Lifetime isoflux control of LED based light sources
23rd THERMINIIC Workshop, Amsterdam , NL, September 2017.
Subtractive Design: A Novel Approach to Heatsink Improvement
32nd SEMI-THERM Symposium, San Jose, CA USA, March 2016
Structure Preserving Approach to Parametric Dynamic Compact Thermal Models of Nonlinear Heat Conduction
31st THERMINIC Workshop, Paris, France, October 2015
Extracting TIM Properties With Localized Transient Pulses
30th SEMI-THERM Conference at San Jose, CA in March 2014
Solder joint Lifetime of Rapid Cycled LED Components
19th THERMINIC Conference at Berlin Germany, in September 2013
A Step Forward in Multi-domain Modeling of Power LEDs
28th SEMI-THERM Symposium at San Jose, CA, in March 2012
An Investigation of Multi-Layer Mini-Channel Heat Sinks with Channel Geometric Scale Variation Suggested by Constructal Scaling Principles
27th SEMI-THERM Symposium at San Jose, CA, in March 2011
The Junction-To-Case Thermal Resistance: A Boundary Condition Dependent Thermal Metric
26th SEMI-THERM Symposium at San Jose, CA, in March 2010
Boiling Heat Transfer and Flow Regimes in Microchannels - a Comprehensive Understanding
15th THERMINIC Workshop at Leuven, Belgium, in October 2009
Hierarchical Nested Surface Channels for Reduced Particle Stacking and Low-Resistance Thermal Interfaces
23rd SEMI-THERM Symposium at San Jose, CA, in March 2007
For their pioneering work in synthetic jets (microjets) for electronics cooling applications over a number of years, described in a number of conference papers, journal papers and magazine articles.
Microjet Cooling Devices for Thermal Management of Electronics
IEEE Transactions on Components And Packaging Technologies, Vol. 26, No. 2, June 2003, pp. 359 - 366
Thermal Management Using Synthetic Jet Ejectors
IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 3, Sept. 2004, pp. 439 - 444
Modeling of Synthetic Jet Ejectors for Electronics Cooling
Proceedings of 23rd IEEE SEMI-THERM Symposium, 18-22 March 2007, pp. 196 - 199
Synthetic Jets For Forced Air Cooling Of Electronics
ElectronicsCooling, Vol. 13, No. 2, May 2007, pp. 12-18
A Coupled Thermoreflectance Thermography Experimental System And Ultra-Fast Adaptive Computational Engine For The Complete Thermal Characterization Of Three-Dimensional Electronic Devices: Validation
THERMINIC Workshop at Nice, Côte d'Azur, France in September 2006
Exceptional Award, made in recognition of his pioneering contributions over two decades to understanding and predicting the thermal behaviour of electronics equipment.
For his many published contributions in the field of electronics thermal management, including championing thermal standards through the JEDEC JC15.1 Committee, of which he is Chairman. Notably, these include the “JEDEC Two-Resistor Compact Model Standard” and the “JEDEC DELPHI Compact Model Guideline”, both of which were being balloted by the Committee at the time of the Award.
Thermal Transient Modeling and Experimental Validation In the European Project PROFIT
SEMI-THERM Symposium at San Jose, CA, in March 2003
Thermal compact models for electronic systems
SEMI-THERM Symposium at San Jose, CA, in March 2002
Characterization of Laminar Jet Impingement Cooling in Portable Computer Applications
SEMI-THERM Symposium at San Jose, CA, in March 2001
Dynamic thermal multiport modeling of IC packages
THERMINIC Workshop at Budapast, Hungary, in September 2000
Validation and Application of Different Experimental Techniques to Measure Electronic Component Operating Junction Temperature
John Lohan, Peter Rodgers, Carl-Magnus Fager, Reijo Lehiniemi, Valérie Eveloy, Pekka Tiilikka, and Jukka Rantala
Transactions of IEEE CPMT, Vol. 22, No. 2, June 1999, pp.252-258
Effect of PCB Thermal Conductivity on the Operating Temperature of an SO-8 Package in a Natural Convection Environment: Experimental Measurement versus Numerical Prediction
John Lohan, Pekka Tiilikka, Peter Rodgers, Carl-Magnus Fager, Jukka Rantala
Proceedings of 5th THERMINIC Workshop, Rome Italy, October 3-6, 1999, pp.207-213
Validating Numerical Predictions of Component Thermal Interaction on Electronic Printed Circuit Boards in Forced Convection Airflows by Experimental Analysis
Peter Rodgers, John Lohan, Valérie Eveloy, Carl-Magnus Fager, and Jukka Rantala
Proceedings of InterPACK Conference, Maui, USA, June 13-17, 1999, Vol. 1, pp.999-1009
Impact of Convective Environment on the Distribution of Heat Transfer from Three Electronic Component Package Types - Operating on Single- and Multi-Component Printed Circuit Boards
Peter Rodgers, John Lohan, Valérie Eveloy, and Carl-Magnus Fager
Proceedings of 5th THERMINIC Workshop, Rome Italy, October 3-6, 1999, pp.214-220
Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in Natural Convection Environments
Peter Rodgers, Valérie Eveloy, John Lohan, Carl-Magnus Fager, Pekka Tiilikka, and Jukka Rantala
Proceeding of SEMI-THERM XV, San Diego, CA, USA, March 9-11 1999, pp.54-64
Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in a Forced Convection Environment: Part 1 - Experimental and Numerical Modelling
Peter Rodgers, Valérie Eveloy, John Lohan, Carl-Magnus Fager, and Jukka Rantala
Proceedings of ASME 33rd NTHC, Albuquerque, NM, USA, August 15-17, 1999
Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in a Forced Convection Environment: Part 2 - Results and Discussion
Peter Rodgers, Valérie Eveloy, John Lohan, Carl-Magnus Fager, and Jukka Rantala
Proceedings of ASME 33rd NTHC, Albuquerque, NM, USA, August 15-17, 1999
Thermal Management in Industrial Product Development
EUROTHERM seminar atNantes, France, in September 1997