About Harvey Rosten

Harvey Rosten studied Physics at London University (Queen Mary College) and at Cambridge University (Dept. of Applied and Theoretical Physics). He went on to complete an M.Phil for work done at the Rutherford Laboratory on the development of software for the calculation of magnetic fields of large super-conducting coils of the kind now used in high-energy particle accelerators.

From 1974 until 1988 he worked for CHAM Limited as a Project Engineer, Development Manager and finally Company Director. For ten years he was the manager responsible for the development of PHOENICS (the World's first commercial general-purpose CFD sofware), from its conception in 1978 to Version 1.4 in 1988.

Harvey Rosten co-founded Flomerics in 1989 along with Dr. David Tatchell. As Flomerics' Technical Director he was responsible for the core solver development for FloTHERM, personally writing the solver used in the first version of FloTHERM.

Recognizing package-level issues as a major bottleneck in the thermal design of electronic systems, he initiated Flomerics' internal Package-Level Thermal Initiative, PLTI, in 1992, which led to Flomerics participation in DELPHI, a major European-funded project to develop thermal characterization methodologies for electronic parts.

Under his direction, Flomerics' team coordinated the project, which ended in late 1996. In their final report to the European Commission, the DELPHI consortium partners concluded that the experimental and model generation techniques developed in the project could provide a complete methodology by which reliable thermal of IC packages could be produced.

Unlike the traditional Rja and Rjc parameters, the 'compact' thermal resistance network models developed in the DELPHI project can be used with confidence for a whole range of different operating environments.

This represents a major advance for the whole electronics-thermal community as it allows components to be accurately modelled at board and system level

As a result of these pioneering efforts, and recognising that the full enefit of compact models will be realized when they are routinely provided by the part vendors Harvey sought and obtained funding was provided for a second project, SEED, to promote the creation and use of compact models. As a result of these projects the study of compact models has become a serious effort at universities and research labs throughout the world.

Harvey died of a brain tumor on Monday 23 June 1997. His premature death is a great loss to those who knew him and worked with him, and to the whole of the electronics cooling community. Harvey's deep understanding of Computational Fluid Dynamics (CFD) and physics, along with his practical hands-on approach made him a true pioneer in the field of thermal analysis of electronic systems.

Harvey was postumously awarded the 1998 IEEE SEMI-THERM THERMI Award, which was accepted by his long-time friend and colleague David Tatchell, CEO of Flomerics.

DELPHI: The Development of Libraries of Physical Models of Electronic Components for an Integrated Design
H. I. Rosten and C. J. M. Lasance
Chapter 5 in Model Generation in Electronic Design, Klewer Press, May 1995.
ISBN: 0-7923-9568-9

The Development of Component-level Thermal Compact Models of a C4/CBGA Interconnect Technology: The Motorola PowerPC 603 and PowerPC 604 RISC Microprocessors
John Parry, Harvey Rosten and Gary B. Kromann
IEEE CPMT Transactions, Part A, Vol. 20 No 1, pp.1043-112, March 1998.

Final Report to SEMI-THERM XIII on the European-Funded Project DELPHI - The Development of Libraries and Physical Models for an Integrated Design Environment
H. Rosten
Evening Tutorial at 13th SEMI-THERM Symp., in Proc. 13th SEMI-THERM Symp., pp.73-91, Austin TX, January 28-30 1997.

DELPHI - A Status Report on the ESPRIT Funded Project for the Creation and Validation of Thermal Models of Electronic Parts
H. Rosten
In Thermal Management of Electronic Systems II,
Proc. of EUROTHERM Seminar 45, pp.17-26, Leuven, September 1995.
ISBN: 0-7923-4612-2

Thermal Characterization of Electronic Devices with Boundary Condition Independent Compact Models
C. Lasance, H. Vinke and H. Rosten,
IEEE CPMT Transactions, Part A, Vol. 14 No 4, pp.723-731, December 1995.

Development, Validation and Application of a Thermal Model of a Plastic Quad Flat Pack
H. Rosten, J. Parry, S. Addison, R. Viswanath, M. Davies and E. Fitzgerald, Proc. 45th ECTC, pp.1140-1151, Las Vegas AZ, May 1995.

Thermal Modeling of the Pentium Processor Package
In Proc. 44th ECTC Conference, pp 421-428, Washington DC, 1-4 May 1994

The Development of Libraries of Thermal Models of Electronic Components for an Integrated Design Environment
H. I. Rosten and C. J. M. Lasance, In Proc. IEPS Conf., pp.138-147, Atlanta, GA, 26-28 September 1994.

A Novel Approach for the Thermal Characterization of Electronic Parts
C. Lasance, H. Vinke, H. Rosten and K-L. Weiner
In Proc. 11th SEMI-THERM Symp., pp.1-9, San Jose, CA, February 1995.

About the Award

Eligibility

To be eligible, the work has to be:

Original

In the public domain. This includes:

papers presented at conferences

papers appearing in journals

other original work, documented in some publicly-available form,
such as a research thesis.

Made publicly-available during the 12 months prior to the cut off
date for nominations

the cut-off date for nominations is October 15th each year

Relevant. The work should:

be primarily concerned with advances in thermal analysis or thermal
modeling of electronics equipment or components, including experiments
aimed specifically at validating numerical models.

have a clear application to practical electronics thermal design.

Favorable consideration will be given to work that demonstrates:

insight into the physical processes affecting the thermal behavior
of electronics components/parts/system

an innovative approach to embodying this understanding

practical application of the advance

Notification of Winner

The author(s) of the winning paper is(are) notified by the Selection Committee.

Presentation of the Award

The presentation is made to the author. In case of co-authored papers, the presentation would normally be made to the leading author.

This year's Award will presented at the IEEE SEMI-THERM Symposium early next year. For more information on the SEMI-THERM Symposium visit the SEMI-THERM home page.

Sponsorship

The Harvey Rosten award for Excellence is supported by Mentor Graphics' Mechanical Analysis Division in Harvey's honor.

Selection Criteria

Eligible works are scored out of 10 against each of the five following dimensions:

Context: Work represents an advance in thermal analysis or thermal modeling of electronics equipment or components, including experiments aimed specifically at validating numerical models.

Relevance: Work demonstrates clear application to practical electronics design.

Physical Insight: Work demonstrates insight into the physical processes affecting the thermal behavior of electronics components, parts and systems.

Innovation: Work is innovative in embodying this understanding in either thermal analysis or thermal modeling.

Pragmatic: A pragmatic approach is taken in the application of the work.

Selection Committee

Dr. Clemens Lasance, Principal Scientist, Philips Research, Retired

Dr. John Parry, Mentor Graphics, (Chairperson)

Bruce Guenin, Principal Hardware Engineer, Oracle Corporation

Dr. Cathy Biber, Thermal Systems Engineer, Intel Corporation

Dr. Jim Wilson, Engineering Fellow, Raytheon

Winning Papers

2017

To be announced

The award is planned to be announced at the next SEMI-THERM Symposium in March 2018 (www.semi-therm.org)

2016

Robin Bornoff, John Wilson, and John Parry

Subtractive Design: A Novel Approach to Heatsink Improvement
32nd SEMI-THERM Symposium, San Jose, CA USA, March 2016

2015

Lorenzo Codecasa, Vincenzo d’Alessandro, Alessandro Magnani, and Niccolò Rinaldi

Structure Preserving Approach to Parametric Dynamic Compact Thermal Models of Nonlinear Heat Conduction
31st THERMINIC Workshop, Paris, France, October 2015

2014

Cameron Nelson, Jesse Galloway, and Phillip Fosnot

Extracting TIM Properties With Localized Transient Pulses
30th SEMI-THERM Conference at San Jose, CA in March 2014

2013

Wendy Luiten

Solder joint Lifetime of Rapid Cycled LED Components
19th THERMINIC Conference at Berlin Germany, in September 2013

2012

András Poppe

A Step Forward in Multi-domain Modeling of Power LEDs
28th SEMI-THERM Symposium at San Jose, CA, in March 2012

2011

Alfonso Ortega, K.S.Harinadh Potluri, and Bryan Hassel

An Investigation of Multi-Layer Mini-Channel Heat Sinks with Channel Geometric Scale Variation Suggested by Constructal Scaling Principles
27th SEMI-THERM Symposium at San Jose, CA, in March 2011

2010

Dirk Schweitzer

The Junction-To-Case Thermal Resistance: A Boundary Condition Dependent Thermal Metric
26th SEMI-THERM Symposium at San Jose, CA, in March 2010

2009

Suresh V. Garimella and Tannaz Harirchian

Boiling Heat Transfer and Flow Regimes in Microchannels - a Comprehensive Understanding
15th THERMINIC Workshop at Leuven, Belgium, in October 2009

2008

R. J. Linderman, T. Brunschwiler, U. Kloter, H. Toy, B. Michel

Hierarchical Nested Surface Channels for Reduced Particle Stacking and Low-Resistance Thermal Interfaces
23rd SEMI-THERM Symposium at San Jose, CA, in March 2007

2007

Raghav Mahalingam and Ari Glezer

For their pioneering work in synthetic jets (microjets) for electronics cooling applications over a number of years, described in a number of conference papers, journal papers and magazine articles.

Dan S. Kercher, Jeong-Bong Lee, Oliver Brand, Mark G. Allen, and Ari Glezer

Microjet Cooling Devices for Thermal Management of Electronics
IEEE Transactions on Components And Packaging Technologies, Vol. 26, No. 2, June 2003, pp. 359 - 366

Raghav Mahalingam, Nicolas Rumigny, and Ari Glezer

Thermal Management Using Synthetic Jet Ejectors
IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 3, Sept. 2004, pp. 439 - 444

Raghav Mahalingam

Modeling of Synthetic Jet Ejectors for Electronics Cooling
Proceedings of 23rd IEEE SEMI-THERM Symposium, 18-22 March 2007, pp. 196 - 199

Raghav Mahalingam, Sam Heffington, Lee Jones and Randy Williams

Synthetic Jets For Forced Air Cooling Of Electronics
ElectronicsCooling, Vol. 13, No. 2, May 2007, pp. 12-18

2006

Peter E. Raad, Pavel L. Komarov, and Mihai G. Burzo

A Coupled Thermoreflectance Thermography Experimental System And Ultra-Fast Adaptive Computational Engine For The Complete Thermal Characterization Of Three-Dimensional Electronic Devices: Validation
THERMINIC Workshop at Nice, Côte d'Azur, France in September 2006

2005

Clemens Lasance

Exceptional Award, made in recognition of his pioneering contributions over two decades to understanding and predicting the thermal behaviour of electronics equipment.

2004

Bruce Guenin

For his many published contributions in the field of electronics thermal management, including championing thermal standards through the JEDEC JC15.1 Committee, of which he is Chairman. Notably, these include the “JEDEC Two-Resistor Compact Model Standard” and the “JEDEC DELPHI Compact Model Guideline”, both of which were being balloted by the Committee at the time of the Award.

2003

Heinz Pape, Dirk Schweitzer, John H.J. Janssen, Arianna Morelli and Claudio M. Villa

Thermal Transient Modeling and Experimental Validation In the European Project PROFIT
SEMI-THERM Symposium at San Jose, CA, in March 2003

2002

Eric Bosch & Mohamed-Nabil Sabry

Thermal compact models for electronic systems
SEMI-THERM Symposium at San Jose, CA, in March 2002

2001

John Guarino & Vincent Manno

Characterization of Laminar Jet Impingement Cooling in Portable Computer Applications
SEMI-THERM Symposium at San Jose, CA, in March 2001

2000

Marta Rencz & Vladimir Székely

Dynamic thermal multiport modeling of IC packages
THERMINIC Workshop at Budapast, Hungary, in September 2000

1999

Peter Rodgers

Validation and Application of Different Experimental Techniques to Measure Electronic Component Operating Junction Temperature
John Lohan, Peter Rodgers, Carl-Magnus Fager, Reijo Lehiniemi, Valérie Eveloy, Pekka Tiilikka, and Jukka Rantala
Transactions of IEEE CPMT, Vol. 22, No. 2, June 1999, pp.252-258

Effect of PCB Thermal Conductivity on the Operating Temperature of an SO-8 Package in a Natural Convection Environment: Experimental Measurement versus Numerical Prediction
John Lohan, Pekka Tiilikka, Peter Rodgers, Carl-Magnus Fager, Jukka Rantala
Proceedings of 5th THERMINIC Workshop, Rome Italy, October 3-6, 1999, pp.207-213

Validating Numerical Predictions of Component Thermal Interaction on Electronic Printed Circuit Boards in Forced Convection Airflows by Experimental Analysis
Peter Rodgers, John Lohan, Valérie Eveloy, Carl-Magnus Fager, and Jukka Rantala
Proceedings of InterPACK Conference, Maui, USA, June 13-17, 1999, Vol. 1, pp.999-1009

Impact of Convective Environment on the Distribution of Heat Transfer from Three Electronic Component Package Types - Operating on Single- and Multi-Component Printed Circuit Boards
Peter Rodgers, John Lohan, Valérie Eveloy, and Carl-Magnus Fager
Proceedings of 5th THERMINIC Workshop, Rome Italy, October 3-6, 1999, pp.214-220

Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in Natural Convection Environments
Peter Rodgers, Valérie Eveloy, John Lohan, Carl-Magnus Fager, Pekka Tiilikka, and Jukka Rantala
Proceeding of SEMI-THERM XV, San Diego, CA, USA, March 9-11 1999, pp.54-64

Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in a Forced Convection Environment: Part 1 - Experimental and Numerical Modelling
Peter Rodgers, Valérie Eveloy, John Lohan, Carl-Magnus Fager, and Jukka Rantala
Proceedings of ASME 33rd NTHC, Albuquerque, NM, USA, August 15-17, 1999

Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in a Forced Convection Environment: Part 2 - Results and Discussion
Peter Rodgers, Valérie Eveloy, John Lohan, Carl-Magnus Fager, and Jukka Rantala
Proceedings of ASME 33rd NTHC, Albuquerque, NM, USA, August 15-17, 1999

1998

Eric Eggink

Thermal Management in Industrial Product Development
EUROTHERM seminar atNantes, France, in September 1997